ATI Technologies FireGL X3-256 Betriebsanweisung Seite 180

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158 007-4701-003
A: Technical Specifications
Note: Power consumption in the XG2N module is slightly higher (approximately 563
watts) than in the base compute module. The XG2N always requires use of two power
supplies at all times. Otherwise, the basic physical and electrical specifications are the
same.
Table A-4 lists the physical specifications for the compute module.
Memory up to 24 GB up to 24 GB
Expansion slot 2 PCI-X 4 PCI-X
Table A-4 Compute Module Physical Specifications
Characteristic Specification
Height 3.44 in. (8.74 cm)
Width 17.06 in. (43.33 cm)
Depth 27 in. (68.58 cm) (with bezel)
Weight 50 lb (22.7 kg) maximum configuration
a
a. Weight will vary depending on whether the system has one or two power supplies, on the amount of DIMMs
installed, and on whether you have one or two disk drives in your system.
Noise 6.0 Bells sound power, up to 30 ºC
Heat dissipation 1315 Btu/hr maximum
Input power 120 - 240 VAC
Table A-3 General Features of the Compute Module (continued)
Feature Base Compute Module Expansion Compute Module
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